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UPC2757TB - SILICON MMIC 1st FREQUENCY DOWN-CONVERTER

Description

The µPC2757TB and µPC2758TB are silicon monolithic integrated circuit designed as 1st frequency downconverter for cellular/cordless telephone receiver stage.

The ICs consist of mixer and local amplifier.

Features

  • low current consumption and the µPC2758TB features improved intermodulation. From these two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size. The µPC2757TB and µPC2758TB are manufactured using NEC’s 20 GHz fT NESAT™||| silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from ex.

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Datasheet Details

Part number UPC2757TB
Manufacturer NEC
File Size 123.17 KB
Description SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
Datasheet download datasheet UPC2757TB Datasheet

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Full PDF Text Transcription

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DATA SHEET µPC2757TB, µPC2758TB SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE BIPOLAR ANALOG INTEGRATED CIRCUITS DESCRIPTION The µPC2757TB and µPC2758TB are silicon monolithic integrated circuit designed as 1st frequency downconverter for cellular/cordless telephone receiver stage. The ICs consist of mixer and local amplifier. The µPC2757TB features low current consumption and the µPC2758TB features improved intermodulation. From these two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size. The µPC2757TB and µPC2758TB are manufactured using NEC’s 20 GHz fT NESAT™||| silicon bipolar process.
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