MTD6N15 - Power MOSFET

Motorola

Datasheet Details

Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max).
TA RθJA dissipation can be increased. Although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can.

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Published: Aug 17, 2010 |