BCW61DLT1 General Purpose Transistors

Motorola Inc

Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BCW61BLT1/D General Purpose Transistors PNP Silicon COLLECTOR 3 1 BASE BCW61BLT1 BCW6.

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Datasheet Specifications

Part number: BCW61DLT1
Manufacturer: Motorola Inc
File Size: 394.84 KB
Datasheet: BCW61DLT1_MotorolaInc.pdf
Description: General Purpose Transistors

Features

* the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT
* 23 package, PD can be calculated as follows: PD = TJ(max)
* TA RθJA SOLDERING PRECAUTIONS The melting temperature of

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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BCW61DLT1 General Purpose Transistors Motorola Inc

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