Datasheet Details
- Part number
- BC850CLT1
- Manufacturer
- Motorola Inc
- File Size
- 220.78 KB
- Datasheet
- BC850CLT1_MotorolaInc.pdf
- Description
- General Purpose Transistors
BC850CLT1 Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BC846ALT1/D General Purpose Transistors BC846ALT1,BLT1 BC847ALT1, COLLECTOR 3 NPN Si.BC850CLT1 Features
* e of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOTBC850CLT1 Applications
* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a📁 Related Datasheet
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