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PM50B4LA060
APPLICATION Photo voltaic power conditioner
PACKAGE OUTLINES
MITSUBISHI
PM50B4LA060
FLAT-BASE TYPE INSULATED PACKAGE
FEATURE a) Adopting new 5th generation IGBT (CSTBTTM) chip, which
performance is improved by 1µm fine rule process. For example, typical Vce(sat)=1.55V @Tj=125°C b) Over-temperature protection by detecting Tj of the CSTBTTM chips and error output is possible from all each conservation upper and lower arm of IPM. c) New small package Reduce the package size by 10%, thickness by 22% from S-DASH series.
PM50B4LA060 Datasheet
