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MUPTB33e3 - Surface Mount Transient Voltage Suppressors

Download the MUPTB33e3 datasheet PDF (MUPT5e3 included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for surface mount transient voltage suppressors.

Description

Microsemi’s unique and new Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions.

Features

  • Powermite package with standoff voltages 5 to 48 V.
  • Both unidirectional and bidirectional polarities: -Anode to case bottom (MUPT5e3 thru MUPT48e3) -Bidirectional (MUPTB5e3 thru MUPTB48e3).
  • Clamping time less than 100 pico-seconds for unidirectional and 5 nano-seconds for bidirectional.
  • 100% surge current testing of all parts.
  • Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
  • Both RoHS and non-RoHS compliant versions availab.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MUPT5e3-Microsemi.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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  • MUPTB24e3 - Surface Mount Transient Voltage Suppressors
  • MUPTB28e3 - Surface Mount Transient Voltage Suppressors
  • MUPTB48e3 - Surface Mount Transient Voltage Suppressors
  • MUPTB5e3 - Surface Mount Transient Voltage Suppressors

Full PDF Text Transcription

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MUPT5e3 – MUPT48e3 and MUPTB5e3 – MUPTB48e3 Available 5V – 48V Powermite1, Surface Mount Transient Voltage Suppressors DESCRIPTION Microsemi’s unique and new Powermite MUPT series of transient voltage suppressors feature oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible electrical degradation under repeated surge conditions. Both unidirectional and bidirectional configurations are available. In addition to its size advantages, the Powermite package includes a fully metallic bottom (anode) side that eliminates the possibility of solder flux entrapment at assembly and a unique locking tab design serves as an integral heat sink. Its innovative design makes this device fully compatible for use with automatic insertion equipment.
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