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AN830 RFID Tag and COB Development Guide

AN830 Description

AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.D.Microchip Technology Inc.Since the direct die att ac.

AN830 Applications

* such as smart labels. The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die. For the flip-chip, it needs a special bumping on the die’s bond pads. Typically the bump material is made of gold with approximately 25 um of height. The f

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RFID Tag and COB Development Guide Microchip
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