Datasheet Specifications
- Part number
- AN830
- Manufacturer
- Microchip ↗
- File Size
- 2.83 MB
- Datasheet
- AN830-Microchip.pdf
- Description
- RFID Tag and COB Development Guide
Description
AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.D.Microchip Technology Inc.Since the direct die att ac.
Applications
* such as smart labels. The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die. For the flip-chip, it needs a special bumping on the die’s bond pads. Typically the bump material is made of gold with approximately 25 um of height. The fAN830 Distributors
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