Datasheet4U Logo Datasheet4U.com

MIC3287 - PWM White LED Driver

Description

The MIC3287 is a 1.2MHz pulse width modulated (PWM) step-up switching regulator that is optimized for constant current white LED driving applications.

Features

  • 2.8V to 5.5V Input Voltage 350mA Switch Current 1.2 MHz PWM Operation 250mV Feedback Voltage 24V Output Over-Voltage Protection (OVP) Option.

📥 Download Datasheet

Datasheet Details

Part number MIC3287
Manufacturer Micrel Semiconductor
File Size 367.13 KB
Description PWM White LED Driver
Datasheet download datasheet MIC3287 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MIC3172 1.25A Switching Regulators Microchip
MIC33030 8MHz 400mA Internal Inductor Buck Regulator MICREL
MIC33050 4MHz Internal Inductor PWM Buck Power Module Microchip
MIC33153 4MHz PWM 1.2A Internal Inductor Buck Regulator MICREL
MIC33153 4MHz 1.2A Internal Inductor PWM Buck Regulator Microchip

Other Datasheets by Micrel Semiconductor

Part Number Description
MIC3289 1.2MHz PWM White LED Driver
MIC3201 High Brightness LED Driver
MIC3202 High-Brightness LED Driver
MIC3202-1 High-Brightness LED Driver
MIC3203 High-Brightness LED Driver Controller

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com MIC3287 Micrel, Inc. MIC3287 1.2MHz PWM White LED Driver with OVP in Thin SOT-23 and 2mm x 2mm MFL™ General Description The MIC3287 is a 1.2MHz pulse width modulated (PWM) step-up switching regulator that is optimized for constant current white LED driving applications. With a maximum output voltage of 24V and a switch current of over 350mA, the MIC3287 drives a string of up to 4 white LEDs in series, ensuring uniform brightness and eliminating several ballast resistors. The MIC3287 implements a constant frequency 1.2MHz PWM current-mode control scheme. The high frequency PWM operation saves board space by reducing external component sizes.
Published: |