Datasheet4U Logo Datasheet4U.com

W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

W82M32V-XBX Description

2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE W82M32V-XBX .

W82M32V-XBX Features

*  Access Times of 12, 15, 17, 20ns
*  Packaging
* 255 PBGA, 25mm x 25mm, 625mm2
*  Organized as 2Mx32
*  Commercial, Industrial and Military Temperature Ranges
*  Low Voltage Operation:
* 3.3V ± 10% Power Supply
*  Low Power CMOS
*  TTL Compatible Inputs

📥 Download Datasheet

Preview of W82M32V-XBX PDF
datasheet Preview Page 2 datasheet Preview Page 3

Datasheet Details

Part number
W82M32V-XBX
Manufacturer
Mercury
File Size
733.46 KB
Datasheet
W82M32V-XBX-Mercury.pdf
Description
2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

📁 Related Datasheet

  • W82C476 - (W82C476 / W82C478) Graphic Color Palette (Winbond Electronics)
  • W82C478 - (W82C476 / W82C478) Graphic Color Palette (Winbond Electronics)
  • W82C485 - (W82C485/487/489) High Color Graphic Palette (Winbond Electronics)
  • W82C487 - (W82C485/487/489) High Color Graphic Palette (Winbond Electronics)
  • W82C489 - (W82C485/487/489) High Color Graphic Palette (Winbond Electronics)
  • W82C610 - MONITOR SOFTWARE OSD IC (Winbond)

📌 All Tags

SRAM 3.3V MULTI-CHIP PACKAGE Mercury
Mercury W82M32V-XBX-like datasheet