IX150T06M-AG XPT IGBT

IXYS

IX150T06M-AG Description

Trench XPT IGBT Chip IX150T06M-AG tentative Type VCE [V] IX150T06M-AG 650 IC Chip Size Package [A] [mm] x [mm] 300 14.2 10.6 sawn on foil.

IX150T06M-AG Features

* / Advantages:
* Easy paralleling due to the positive temperature coefficient of the on-state voltage
* Rugged Trench XPT design (Xtreme light Punch Through) results in: - short circuit rated for 10 µsec. - very low gate charge - square RBSOA @ 2x Ic - low EMI - Tvjm = 175°C
* Thin wafer

IX150T06M-AG Applications

* AC motor drives
* Solar inverter
* Medical equipment
* Uninterruptible power supply
* Air-conditioning systems
* Welding equipment Parameters Area active Area total Wafer size Ø Thickness Material Max. possible chips Passivation Metallization Recom. wire bonds (Al) Solder

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Datasheet Details

Part number: IX150T06M-AG
Manufacturer: IXYS
File Size: 69.47 KB
Datasheet: IX150T06M-AG-IXYS.pdf
Description: XPT IGBT

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