Description
Number Time
1
V1.0
20200310 LMY
LJH
First edition
2
V1.2
20200512 LMY
ZYP
Update datasheet
HJ-531IMF
TangShan HongJia Electronic Technology Co., Ltd.-1-
2 Overview
HJ-531IMF
2.1
Features
- 14 4.5 Power Dissipation - 14 5 Reflow Soldering Information- 15 6 Notices for Ultrasound Welding - 16 7 Supply Information - 17 7.1 Model Definition - 17 7.2 Packaging method- 17 -
TangShan HongJia Electronic Technology Co. , Ltd. 1 Version History
Table 1-1 Revision History
No. Version Release Reviser Checker.
HJ-531IMF-HongJia.pdf
