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SS149A - (SS100 Series) Surface Mount Digital Position Sensors

Download the SS149A datasheet PDF. This datasheet also covers the SS141A variant, as both devices belong to the same (ss100 series) surface mount digital position sensors family and are provided as variant models within a single manufacturer datasheet.

Features

  • ɀ Quad Hall design virtually eliminates mechanical stress effects ɀ Temperature compensated magnetics ɀ Bipolar, unipolar, latching magnetics ɀ Super high sensitivity available ɀ Symmetry of operate/release points about zero gauss (bipolar/latching) ɀ Operating temperature range of.
  • 40 to ⍣125°C ɀ Low current consumption (7 mA typical @ 5 V, 25°C) ɀ 3.8 to 30 VDC supply voltage range ɀ High output current capability of 50 mA absolute maximum ORDER GUIDE Catalog Listing Magnetic Type Sup.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (SS141A_Honeywell.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number SS149A
Manufacturer Honeywell
File Size 253.44 KB
Description (SS100 Series) Surface Mount Digital Position Sensors
Datasheet download datasheet SS149A Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com Interactive Catalog Replaces Catalog Pages Honeywell Sensing and Control has replaced the PDF product catalog with the new Interactive Catalog. The Interactive Catalog is a power search tool that makes it easier to find product information. It includes more installation, application, and technical information than ever before. Click this icon to try the new Interactive Catalog. Sensing and Control Honeywell Inc. 11 West Spring Street Freeport, Illinois 61032 www.DataSheet4U.com Solid State Sensors Surface Mount Digital Position Sensors The temperature compensated Hall effect sensor consists of a quad Hall sensing element in a square integrated circuit chip, which is then encapsulated in a glass-filled thermoset molding material.
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