Datasheet4U Logo Datasheet4U.com

MSA-0500 - Cascadable Silicon Bipolar MMIC Amplifier

Download the MSA-0500 datasheet PDF. This datasheet also covers the MSA-0500_Hewlett variant, as both devices belong to the same cascadable silicon bipolar mmic amplifier family and are provided as variant models within a single manufacturer datasheet.

Description

MSA-0500 Absolute Maximum Ratings Parameter Device Current Power Dissipation[2,3] RF Input Power Junction Temperature Storage Temperature Absolute Maximum[1] 225 mA 3.0 W +25 dBm 200°C

Notes: 1.

Features

  • Cascadable 50 Ω Gain Block.
  • High Output Power: +23 dBm Typical P1 dB at 1.0␣ GHz.
  • Low Distortion: 33␣ dBm Typical IP 3 at 1.0␣ GHz.
  • 8.5 dB Typical Gain at 1.0␣ GHz The MSA-series is fabricated using HP’s 10 GHz fT, 25␣ GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MSA-0500_Hewlett-Packard.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MSA-0500
Manufacturer Hewlett-Packard
File Size 66.77 KB
Description Cascadable Silicon Bipolar MMIC Amplifier
Datasheet download datasheet MSA-0500 Datasheet

Full PDF Text Transcription

Click to expand full text
Cascadable Silicon Bipolar MMIC␣ Amplifier Technical Data MSA-0500 Features • Cascadable 50 Ω Gain Block • High Output Power: +23 dBm Typical P1 dB at 1.0␣ GHz • Low Distortion: 33␣ dBm Typical IP 3 at 1.0␣ GHz • 8.5 dB Typical Gain at 1.0␣ GHz The MSA-series is fabricated using HP’s 10 GHz fT, 25␣ GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility. The recommended assembly procedure is gold-eutectic die attach at 400°C and either wedge or ball bonding using 0.7 mil gold wire.
Published: |