1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs. 10 Signal: 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. Ground Plate Signal contact m 5m 0.7
mm
m 5m
Housing
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT c.
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FX118 - Duplex Frequency Inverter(Consumer Microcircuits Limited)
FX11-HRS.pdf
