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DGS60 - General Purpose Rectifier GPP Chips

Description

The GPP chips series are diffused silicon, glass passivated rectifier die.

These devices can be supplied to meet customer’s requirements.

The prime application for unencapsulated die is in hybrid circuits.

Features

  • ˙ Fully glass passivated -needs no encapsulation ˙ Peak reverse voltage to 1800 volts ˙ Low forward voltage drop(VF) ˙ Metallized surface Glass AT w.

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Datasheet Details

Part number DGS60
Manufacturer GOOD ELECTRONIC
File Size 68.19 KB
Description General Purpose Rectifier GPP Chips
Datasheet download datasheet DGS60 Datasheet

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DGS70 General Purpose Rectifier GPP Chips

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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DGS60 THRU DGS70 General Purpose Rectifier GPP Chips Features ˙ Fully glass passivated -needs no encapsulation ˙ Peak reverse voltage to 1800 volts ˙ Low forward voltage drop(VF) ˙ Metallized surface Glass AT w Description The GPP chips series are diffused silicon, glass passivated rectifier die. These devices can be supplied to meet customer’s requirements. The prime application for unencapsulated die is in hybrid circuits. For this reason, a variety of metallized surfaces are available. Gold is standard for wire bonding, and for soldering application, gold flash chips are supplied.
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