MB84VD23381FJ Datasheet (Fujitsu Media Devices) - Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM

MB84VD23381FJ, Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM

Pin Name A19 to A0 A21, A20 DQ15 to DQ0 CEf CE1r CE2r OE WE RY/BY UB LB RESET WP/ACC N.C.

VSS VCCf VCCr Address Inputs (Common) Address Inputs (Flash) Data Inputs/Outputs (Common) Chip Enable (Flash) Chip Enable (FCRAM) Chip Enable (FCRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Outp

( DataSheet : www.DataSheet4U.com ) SPANSION MCP Data Sheet TM September 2003 TM This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and Fujitsu.

Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.

Continuity of Specifications There is no change to this datasheet as a result of offering the device as a SPANSION revisions

MB84VD23381FJ Features

* Power Supply Voltage of 2.7 V to 3.1 V

* High Performance 70 ns maximum access time (Flash) 80 ns maximum access time (FCRAM)

* Operating Temperature

* 30 °C to +85 °C

* Package 65-ball FBGA (Continued) s PRODUCT LINEUP Flash Memory Power Supply Voltage ( V