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MPC560xC - (MPC560xB/C) Automotive Body and Gateway Applications

Download the MPC560xC datasheet PDF (MPC560xB included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for (mpc560xb/c) automotive body and gateway applications.

Description

JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT144) (Soldered) Kits include main board, mini-module and P&E wiggler Mini-modules/kits available in socketed (~$450) and soldered (~$350) versions; Final production version will be soldered Mini-mo

Features

  • required to handle complex control and diagnostic systems. In addition, these scalable devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly implement your designs.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MPC560xB_Freescale.pdf) that lists specifications for multiple related part numbers.
Other Datasheets by Freescale

Full PDF Text Transcription

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Color Indicator Bar/Volume no. 32-bit Microcontrollers MPC560xB/C Family Automotive body and gateway applications Overview The MPC560xB/C family of 32-bit microcontrollers (MCUs) includes Freescale’s latest in integrated devices for automotive body electronics applications. The advanced, cost-efficient host processor core takes full www.DataSheet4U.
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