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QSC113 - PLASTIC SILICON INFRARED PHOTOTRANSISTOR

Description

The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package.

Features

  • Tight production distribution.
  • Steel lead frames for improved reliability in solder mounting.
  • Good optical-to-mechanical alignment.
  • Plastic package is infrared transparent black to attenuate visible light.
  • Mechanically and spectrally matched to the QECXXX LED.
  • Black plastic body allows easy recognition from LED.  2001 Fairchild Semiconductor Corporation DS300358 7/09/01 1 OF 4 www. fairchildsemi. com.

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QSC113 PLASTIC SILICON PHOTOTRANSISTOR QT Optoelectronics
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Other Datasheets by Fairchild (onsemi)

Part Number Description
QSC112 PLASTIC SILICON INFRARED PHOTOTRANSISTOR
QSC114 PLASTIC SILICON INFRARED PHOTOTRANSISTOR

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 PACKAGE DIMENSIONS 0.116 (2.95) REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) QSC113 QSC114 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER 0.100 (2.54) NOM SCHEMATIC COLLECTOR 0.155 (3.94) 0.018 (0.46) SQ. (2X) NOTES: 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified. EMITTER DESCRIPTION The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. FEATURES • Tight production distribution. • Steel lead frames for improved reliability in solder mounting. • Good optical-to-mechanical alignment. • Plastic package is infrared transparent black to attenuate visible light.
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