Datasheet Specifications
- Part number
- 708SRAP-R-AU-01
- Manufacturer
- ETC
- File Size
- 68.11 KB
- Datasheet
- 708SRAP-R-AU-01-ETC.pdf
- Description
- AlGaInP Red LED chip
Description
AlGaInP Red LED chip .
Applications
* Characteristics: (1) Size Chip Size: 8 mil x 8 mil (203±25 µm x 203±25 µm) Chip Thickness: 7 mil (180±25µm ) typical Bonding Pad: 6 mil (152±10 µm) in diameter (2) Metallization: P electrode：Au pad N electrode：Au alloy (3) Structure: Refer to drawing Type: 708SRAP-R-AU-01 1.6 0.8 unit: mil 6 78708SRAP-R-AU-01 Distributors
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