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DIM200MKS12-A000 - Igbt Modules - Chopper

Features

  • I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY.

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Datasheet Details

Part number DIM200MKS12-A000
Manufacturer Dynex Semiconductor
File Size 204.00 KB
Description Igbt Modules - Chopper
Datasheet download datasheet DIM200MKS12-A000 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Replaces November 2002, issue DS5552-1.2 DS5552-1.2 November 2002 FEATURES I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES (typ) VCE(sat)* (max) IC (max) IC(PK) 1200V 2.2V 200A 400A *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS I I I I I Choppers Motor Controllers Induction Heating Resonant Converters Power Supplies 1(K,E) 2(A) 3(C) 9(C1) 4(G1) 5(E1) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A.
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