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DDZ5V1ASF - 0.5W SURFACE MOUNT PRECISION ZENER DIODE

Download the DDZ5V1ASF datasheet PDF. This datasheet also covers the DDZ2V4ASF variant, as both devices belong to the same 0.5w surface mount precision zener diode family and are provided as variant models within a single manufacturer datasheet.

Features

  • 500mW Power Dissipation on FR-4 PCB.
  • Very Tight Tolerance on VZ.
  • Ideally Suited for Automated Assembly Processes.
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 &2).
  • Halogen and Antimony Free. "Green" Device (Note 3) Mechanical Data.
  • Case: SOD323F.
  • Case Material: Molded Plastic, “Green Molding Compound”. UL Flammability Classification Rating 94V-0.
  • Moisture Sensitivity: Level 1 per J-STD-020.
  • Terminal Connections: Cathode Band.
  • Terminals: Fi.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DDZ2V4ASF-Diodes.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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DDZ1x (DDZ5V1B - DDZ43) SURFACE MOUNT PRECISION ZENER DIODE Diodes Incorporated
DDZ1xB (DDZ5V1B - DDZ43) SURFACE MOUNT PRECISION ZENER DIODE Diodes Incorporated

Other Datasheets by Diodes Incorporated

Part Number Description
DDZ5V1B SURFACE MOUNT PRECISION ZENER DIODE
DDZ5V1BSF 0.5W SURFACE MOUNT PRECISION ZENER DIODE
DDZ5V1CSF 0.5W SURFACE MOUNT PRECISION ZENER DIODE
DDZ5V6ASF 0.5W SURFACE MOUNT PRECISION ZENER DIODE
DDZ5V6B SURFACE MOUNT PRECISION ZENER DIODE

Full PDF Text Transcription

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NEW PRODUCT YM DDZ2V4ASF – DDZ39DSF 0.5W SURFACE MOUNT PRECISION ZENER DIODE Features  500mW Power Dissipation on FR-4 PCB  Very Tight Tolerance on VZ  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 &2)  Halogen and Antimony Free. "Green" Device (Note 3) Mechanical Data  Case: SOD323F  Case Material: Molded Plastic, “Green Molding Compound”. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: Cathode Band  Terminals: Finish – Matte Tin Annealed over Copper Alloy Leadframe. Solderable per MIL-STD-202, Method 208  Weight: 0.
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