-Lead less chip form, no lead damage. -Low power loss, High efficiency. -High current capability, low VF. -Plastic package has Underwriters Laboratory Flammability Classification 94V-0 . 0.085(2.15) 0.073(1.85)
TO-277(Z3)
Top View Bottom View
0.132(3.35) 0.120(3.05)
0.262(6.65) 0.250(6.35)
0.187(4.75) 0.175(4.45)
Mechanical data
-Case: Packed with FRP substrate and epoxy underfilled. -Terminals: Pure Tin plated (Lead-Free), solderable per MIL-STD-750, method 2026. - Weight: 0.08 grams (appro.