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C470UT170 LED

C470UT170 Description

Cree® UltraThin® Gen 3 LEDs Data Sheet CxxxUT170-Sxxxx-31 Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bon.

C470UT170 Features

* Small Chip
* 170 x 170 x 50 μm
* Single Wire Bond Structure
* UT LED Performance
* 450 nm
* 12+ mW
* 460 nm
* 10+ mW
* 470 nm
* 10+ mW
* 527 nm
* 4+ mW
* Low Forward Voltage
* 2.9 V Ty

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Datasheet Details

Part number
C470UT170
Manufacturer
CREE
File Size
263.03 KB
Datasheet
C470UT170-CREE.pdf
Description
LED

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