HC1000 - Gel-Like Modulus Gap Filling Material

Datasheet Details

Part number	HC1000
Manufacturer	Bergquist
File Size	52.46 KB
Description	Gel-Like Modulus Gap Filling Material
Datasheet	HC1000-Bergquist.pdf

Thermal conductivity: 1.0 W/m-K.
Highly conformable, low hardness.
“Gel-like” modulus.
Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered.

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Published: Mar 6, 2015 |