HC1000 Gel-Like Modulus Gap Filling Material

Description

Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section E .

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HC1000 Datasheet Preview — Preview of HC1000 PDF

Datasheet Specifications

Part number: HC1000
Manufacturer: Bergquist
File Size: 52.46 KB
Datasheet: HC1000-Bergquist.pdf
Description: Gel-Like Modulus Gap Filling Material

Features

* Thermal conductivity: 1.0 W/m-K
* Highly conformable, low hardness
* “Gel-like” modulus
* Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical

Applications

* Include:
* Computer and peripherals
* Telecommunications
* Heat interfaces to frames, chassis, or other heat spreading devices
* RDRAM™ memory modules / chip scale packages
* CDROM / DVD cooling
* Areas where irregular surfaces need to make a thermal i

HC1000 Distributors

📁 Related Datasheet

HC10 HC101 HC106B HC106BF HC106BS HC106D

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HC1000 Gel-Like Modulus Gap Filling Material Bergquist

Bergquist HC1000-like datasheet