PSMN012-60HL datasheet, mosfet equivalent, nexperia

Features and benefits

* High reliability LFPAK56D package, copper-clip, solder die attach and qualified to 175 °C
* Tested to 1 Bn avalanche events
* LFPAK copper clip package tech.

Application

* Brushless DC and Brushed DC motor control
* DC-to-DC converters
* High-performance synchronous rectificati.

Description

Dual logic level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package, using application specific (ASFET) repetitive avalanche silicon technology. 2. Features and benefits
* High reliability LFPAK56D package, copper-clip, solder die attach a.

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