Datasheet4U Logo Datasheet4U.com

PMEG60T30ELR - Schottky barrier rectifier

Description

Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP3 (SOD123W) small and flat lead Surface-Mounted Device (SMD) plastic package.

2.

Features

  • Average forward current: IF(AV) ≤ 3 A.
  • Reverse voltage: VR ≤ 60 V.
  • Low forward voltage.
  • Low leakage current due to Trench MEGA Schottky technology.
  • High power capability due to clip-bonding technology.
  • Small and flat lead SMD power plastic package.
  • Capable for reflow and wave soldering.
  • AEC-Q101 qualified 3.

📥 Download Datasheet

Datasheet preview – PMEG60T30ELR

Datasheet Details

Part number PMEG60T30ELR
Manufacturer nexperia
File Size 230.83 KB
Description Schottky barrier rectifier
Datasheet download datasheet PMEG60T30ELR Datasheet
Additional preview pages of the PMEG60T30ELR datasheet.

📁 Similar Datasheet

  • PMEG6002EB - very low VF MEGA Schottky barrier rectifiers (NXP)
  • PMEG6002EJ - 200 MA Low Vf MEGA Schottky Barrier Rectifier (NXP)
  • PMEG6002TV - very low VF MEGA Schottky barrier rectifiers (NXP)
  • PMEG6010AED - Low VF (MEGA) Schottky barrier diode (NXP)
  • PMEG6010CEH - 1 A very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
  • PMEG6010CEJ - 1 A very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
  • PMEG6010CPAS - 1A low VF dual MEGA Schottky barrier rectifier (NXP)
  • PMEG6010ELR - 1A low leakage current Schottky barrier rectifier (NXP)
  • PMEG6010ER - 1A low VF MEGA Schottky barrier rectifier (NXP)
  • PMEG6010ETR - Schottky barrier rectifier (NXP Semiconductors)
Other Datasheets by nexperia

Full PDF Text Transcription

Click to expand full text
PMEG60T30ELR 60 V, 3 A low leakage current Trench MEGA Schottky barrier rectifier 24 May 2018 Product data sheet 1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP3 (SOD123W) small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 3 A • Reverse voltage: VR ≤ 60 V • Low forward voltage • Low leakage current due to Trench MEGA Schottky technology • High power capability due to clip-bonding technology • Small and flat lead SMD power plastic package • Capable for reflow and wave soldering • AEC-Q101 qualified 3.
Published: |