Datasheet4U Logo Datasheet4U.com

PMEG2010EPA - MEGA Schottky barrier rectifier

Description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection.

PMEG2010EPA is encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

Features

  • Average forward current: IF(AV) ≤ 1 A.
  • Reverse voltage: VR ≤ 20 V.
  • Low forward voltage.
  • Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity.
  • Leadless small SMD plastic package with medium power capability.
  • AEC-Q101 qualified 1.3.

📥 Download Datasheet

Datasheet Details

Part number PMEG2010EPA
Manufacturer Nexperia
File Size 136.39 KB
Description MEGA Schottky barrier rectifier
Datasheet download datasheet PMEG2010EPA Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
PMEG2010EPK low VF MEGA Schottky barrier rectifier NXP Semiconductors
PMEG2010EA Low VF (MEGA) Schottky barrier diode Philips
PMEG2010EV Low VF MEGA Schottky barrier diode NXP Semiconductors
PMEG2010AEB 20V 1A ultra low VF MEGA Schottky barrier rectifier NXP Semiconductors
PMEG2010AEH MEGA Schottky barrier rectifiers NXP

Other Datasheets by Nexperia

Part Number Description
PMEG2010EH MEGA Schottky barrier rectifiers
PMEG2010EJ MEGA Schottky barrier rectifiers
PMEG2010ER MEGA Schottky barrier rectifier
PMEG2010ET MEGA Schottky barrier rectifiers
PMEG2010AEB 1A low VF MEGA Schottky barrier rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PMEG2010EPA 1 A low VF MEGA Schottky barrier rectifier Rev. 01 — 15 December 2009 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. PMEG2010EPA is encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. 1.2 Features „ Average forward current: IF(AV) ≤ 1 A „ Reverse voltage: VR ≤ 20 V „ Low forward voltage „ Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity „ Leadless small SMD plastic package with medium power capability „ AEC-Q101 qualified 1.
Published: |