PHPT60606PY datasheet, transistor equivalent, nexperia

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datasheet Download (Size : 706.21KB)

Features and benefits

* High thermal power dissipation capability
* Suitable for high temperature applications up to 175 °C
* Reduced Printed-Circuit Board (PCB) requirements compa.

Application

up to 175 °C
* Reduced Printed-Circuit Board (PCB) requirements comparing to transistors in DPAK
* High energy e.

Description

PNP high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. NPN complement: PHPT60606NY. 2. Features and benefits
* High thermal power dissipation capability
* Suitable for high temperature app.

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