* Fully automotive qualified to AEC-Q101 at 175 °C
* Enhanced SOA technology for improved linear mode performance
* LFPAK copper clip package technology:
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2. Features and benefits
* Fully automotive qualified to AEC-Q101 at 175 °C
* Enhanced SOA technology for impr.

Single, logic level, N-channel MOSFET in LFPAK33 using Application specific (ASFET) Enhanced SOA technology. This product has been designed and qualified to AEC-Q101 for use in linear mode in airbag applications. 2. Features and benefits
* Fully.

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