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PGA460-Q1 - Automotive Ultrasonic Signal Processor and Transducer Driver

Description

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core.

Features

  • Fully integrated solution for ultrasonic sensing.
  • AEC-Q100 qualified with the following results:.
  • Device temperature grade 2:.
  • 40°C to +105°C ambient operating temperature.
  • Device HBM ESD classification level 2.
  • Device CDM ESD classification level C4B.
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation.
  • Single transducer for bot.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PGA460-Q1 SLASEC8C – FEBRUARY 2017 – REVISED FEBRUARY 2023 PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver 1 Features • Fully integrated solution for ultrasonic sensing • AEC-Q100 qualified with the following results: – Device temperature grade 2: –40°C to +105°C ambient operating temperature – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
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