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CD4010B-Q1 Datasheet Preview

CD4010B-Q1 Datasheet

CMOS HEX BUFFER/CONVERTER

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CD4010B-Q1
www.ti.com
SCHS379A MARCH 2010 REVISED JANUARY 2012
CMOS HEX BUFFER/CONVERTER
Check for Samples: CD4010B-Q1
FEATURES
1
Qualified for Automotive Applications
100% Tested for Quiescent Current at 20 V
Maximum Input Current of 1 µA at 18 V Over
Full Package-Temperature Range:
100 nA at 18 V and 25°C
5-V, 10-V, and 15-V Parametric Ratings
Latch-Up Performance Meets 100 mA per
JESD 78, Class I
D PACKAGE
(TOP VIEW)
APPLICATIONS
CMOS to DTL/TTL Hex Converter
CMOS Current "Sink" or "Source" Driver
CMOS High-to-Low Logic-Level Converter
Multiplexer: 1-to-6 or 6-to-1
DESCRIPTION
CD4010B hex buffer/converter may be used as CMOS to TTL or DTL logic-level converters or CMOS
high-sink-current drivers.
The CD4050B is the preferred hex buffer replacement for the CD4010B in all applications except multiplexers.
For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is
recommended.
The CD4010B is supplied in 16-lead hermetic dual-in-line ceramic (D) packages.
TA
40°C to 125°C
SOIC D
ORDERING INFORMATION(1)
PACKAGE (2)
ORDERABLE PART NUMBER
Reel of 2500
CD4010BQDRQ1
TOP-SIDE MARKING
CD4010BQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 20102012, Texas Instruments Incorporated




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CD4010B-Q1 Datasheet Preview

CD4010B-Q1 Datasheet

CMOS HEX BUFFER/CONVERTER

No Preview Available !

CD4010B-Q1
SCHS379A MARCH 2010 REVISED JANUARY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 1. Schematic Diagram One of Six Identical Stages
Functional Diagram
2 Submit Documentation Feedback
Copyright © 20102012, Texas Instruments Incorporated
Product Folder Link(s): CD4010B-Q1


Part Number CD4010B-Q1
Description CMOS HEX BUFFER/CONVERTER
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