CC2650 Datasheet | Texas Instruments

Overview 1.1 Features - Microcontroller - Powerful ARM® Cortex®-M3 - EEMBC Core Mark® Score: 142 - Up to 48-MHz Clock Speed - 128KB of In-System Programmable Flash - 8KB of SRAM for Cache - 20KB of Ultralow-Leakage SRAM - 2-Pin c JTAG and JTAG Debugging - Supports Over-The-Air Upgrade (OTA) - Ultralow-Power Sensor Controller - Can Run Autonomous From the Rest of the System - 16-Bit Architecture - 2KB of Ultralow-Leakage SRAM for Code and Data - Efficient Code Size Architecture, Placing Drivers, Bluetooth® Low Energy Controller, IEEE 802.15.4 MAC, and Bootloader in ROM - Ro HS-pliant Packages - 4-mm × 4-mm RSM VQFN32 (10 GPIOs) - 5-mm × 5-mm RHB VQFN32 (15 GPIOs) - 7-mm × 7-mm RGZ VQFN48 (31 GPIOs) - Peripherals - All Digital Peripheral Pins Can Be Routed to Any GPIO - Four General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timers, PWM Each) - 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX - Continuous Time parator - Ultralow-Power Analog parator - Programmable Current Source - UART - 2× SSI (SPI, MICROWIRE, TI) - I2C - I2S - Real-Time Clock (RTC) - AES-128 Security Module - True Random Number Generator (TRNG) - 10, 15, or 31 GPIOs, Depending on Package Option - Support for Eight Capacitive-Sensing Buttons - Integrated Temperature Sensor - External System - On-Chip internal DC-DC...