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MBC08MH - Bridge Rectifier

Download the MBC08MH datasheet PDF. This datasheet also covers the MBC08JH variant, as both devices belong to the same bridge rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Halogen-free type.
  • Internal structure with GPRC (glass passivated rectifier chip) inside.
  • Compliance to RoHS product.
  • Lead less chip form, no lead damage.
  • Low power loss, High efficiency.
  • High current capability.
  • Plastic package has Underwriters Laboratory Flammability Classification 94V-0.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MBC08JH-ZowieTechnology.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MBC08MH
Manufacturer Zowie Technology
File Size 45.36 KB
Description Bridge Rectifier
Datasheet download datasheet MBC08MH Datasheet

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Other Datasheets by Zowie Technology

Part Number Description
MBC08JH Bridge Rectifier
MBC08KH Bridge Rectifier
MBC10JH Bridge Rectifier
MBC10KH Bridge Rectifier
MBC10MH Bridge Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
ZOWIE Bridge Rectifier Preliminary MBC08JH THRU MBC08MH FEATURES * Halogen-free type * Internal structure with GPRC (glass passivated rectifier chip) inside * Compliance to RoHS product * Lead less chip form, no lead damage * Low power loss, High efficiency * High current capability * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 APPLICATION * AC/DC Power Supply * Communication Equipment 1.00 ± 0.05 6.15 ± 0.1 OUTLINE DIMENSIONS Case : MBC 4.75 ± 0.1 2.54 ± 0.05 ~~ 1.40 ± 0.05 4 1 1.20 MAX. 5.90 REF. (600V~1000V / 0.8A) Unit : mm Mounting Pad Layout 2.50 MAX. 1.20 MAX. 1.07 ± 0.15 MECHANICAL DATA Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026.