CTCD210
Key Features
- 319(8.10) 0.311(7.90)
- 0022(0.055) 0.0018(0.045)
- Lead free product * Leadless chip form , no lead damage
- Lead-free solder joint , no wire bond & lead frame
- 201(5.10) 0.193(4.90) 0.157(4.00) 0.315(3.80)
- 00.3013(20(.08.27)8)
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0 T* For surface mounted applications in order to optimize board space E* Low profile package E* Built-in strain relief
- Glass passivated junction SH* Low inductance
- 081(2.05) 0.073(1.85)
- High temperature soldering: 260oC/10 seconds at terminals TA0.037(1.20)
