0.319(8.10) 0.311(7.90) 0.0022(0.055) 0.0018(0.045) * Lead free product * Leadless chip form , no lead damage * Lead-free solder joint , no wire bond & lead frame 0..

in order to optimize board space E* Low profile package E* Built-in strain relief * Glass passivated junction SH* Low in.

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts