FS1002FL
Key Features
- For surface mounted applications in order to optimize board space
- Ideal for automated placement
- Glass Passivated Chip Junction
- High temperature soldering : 260℃/10 seconds at terminals
- Lead‐free & halogen‐free parts, RoHS pliant
- 機械數據 Mechanical Data
- Case: Molded plastic over passivated junction
- Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026
- Polarity: Color band denotes cathode end
- Weight: approx.. 0.0173 grams
