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CAB450M12XM3
VDS
1200 V
5
4 IDS 3
450 A 2
1
1200 V, 2.6 mΩ, Silicon Carbide, Half-Bridge Module
D
Technical Features
• High Power Density Footprint • High Junction Temperature (175 °C) Operation • Low-Inductance (6.7 nH) Design • Implements Conduction-Optimized Third
Generation SiC MOSFET Technology
• Silicon Nitride Insulator and Copper Baseplate
• 1200 V Drain-Source Voltage
C
V+ V+
G1 K1
G2 K2
V-
Mid
NTC1 -t°
NTC2
Applications • Motor & Motion Control • Vehicle Fast Chargers • Uninterruptible Power Supplies • Smart-Grid / Grid-Tied Distributed Generation • Traction Drives • E-mobility
System Benefits
3 8,9
• Terminal layout allows for direct bus bar connection
wBithout bends or bushings inductance design.