W25X16BVDAIG datasheet, memory equivalent, Winbond

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......... 4 3. PIN CONFIGURATION SOIC 150 / 208-MIL........ 5 4. PAD CONFIGURATION WSON 6X5-MM .. 5 5. PAD CONFIGURATION PDIP 300-MIL...... 6 6. PIN DESCRIPTION S.

Description

..... 4 2. FEATURES ......... 4 3. PIN CONFIGURATION SOIC 150 / 208-MIL........ 5 4. PAD CONFIGURATION WSON 6X5-MM .. 5 5. PAD CONFIGURATION PDIP 300-MIL...... 6 6. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM. 6 7. PIN C.

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