W25Q80EWSNIQ datasheet, memory equivalent, Winbond

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..... 5 3. PACKAGE TYPES: ... 6 3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil .. 6 3.2 PAD Configuration WSON 6x5-MM AND USON 2x3-mm . 6 3.3 Pin Description SOI.

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......... 5 2. FEATURES ..... 5 3. PACKAGE TYPES: ... 6 3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil .. 6 3.2 PAD Configuration WSON 6x5-MM AND USON 2x3-mm . 6 3.3 Pin Description SOIC150/208-mil, VSOP 150-mil, WSON 6x5-MM,USON 2x3 ........

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