W25Q64CVDAIG datasheet, memory equivalent, Winbond

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Features and benefits

..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm ......... 6 3.3 Pin.

Description

. 5 2. FEATURES ..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm ......... 6 3.3 Pin Configuration PDIP 300-mil .. 7 3.4 Pin Description SOIC/VSOP 2.

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