logo

W25Q40BWUXIG Winbond 1.8V 4M-BIT SERIAL FLASH MEMORY

Description ... 5 2. FEATURES... 5 3. PIN CONFIGURATION SOIC/VSOP 150-MIL ... 6 4. PAD CO...
Features ...................................................................................................................................... 5 3. PIN CONFIGURATION SOIC/VSOP 150-MIL ................................................................................. 6 4. PAD CONFIGURATION WSON 6X5-MM, USON 2X3-MM ...........................................

Datasheet PDF File W25Q40BWUXIG Datasheet - 2.44MB

W25Q40BWUXIG  






logo
Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Site map