W25Q40BVUXIP datasheet, memory equivalent, Winbond

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Features and benefits

..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil...... 6 3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm ........ 6 3.3 Pin Conf.

Description

. 5 2. FEATURES ..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil...... 6 3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm ........ 6 3.3 Pin Configuration PDIP 300-mil .. 6 3.4 Pin Description SOIC, VSOP, WS.

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