W25Q32JWBYIM datasheet, memory equivalent, Winbond

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Features and benefits

......... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS . 5 3.1 Pin Configuration SOIC 150-mil / 208-mil ... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ... .

Description

.... 4 2. FEATURES ......... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS . 5 3.1 Pin Configuration SOIC 150-mil / 208-mil ... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ... 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x.

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