W25Q32FWBYIG datasheet, memory equivalent, Winbond

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.... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 5 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm .... 5 .

Description

......... 4 2. FEATURES..... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 5 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm .... 5 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8.

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