W25Q32BV datasheet, memory equivalent, Winbond

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Features and benefits

..... 5 PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC 208-mil . 6 Pad Configuration WSON.

Description

. 5 FEATURES ..... 5 PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC 208-mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm ......... 6 Pin Configuration PDIP 300-mil .. 7 Pi.

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