W25Q16JVUXIM datasheet, memory equivalent, Winbond

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.... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 5 3.1 Pin Configuration SOIC 150/208-mil .... 5 3.2 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm.

Description

......... 4 2. FEATURES..... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 5 3.1 Pin Configuration SOIC 150/208-mil .... 5 3.2 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm ....... 5 3.3 Pin Description SOIC 150/208-mil, WSON .

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