W25Q16DWUUIP datasheet, memory equivalent, Winbond

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.... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm 6 3.3 Pin Descript.

Description

. 5 2. FEATURES..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm 6 3.3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm . 6 3.4 Ball .

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