W25Q16CVZPIG datasheet, memory equivalent, Winbond

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Features and benefits

..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm ...... 6 3.3 Pin Configuration PDIP.

Description

. 5 2. FEATURES ..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm ...... 6 3.3 Pin Configuration PDIP 300-mil .. 7 3.4 Pin Description SOIC 150/208-mil, WSON 6x5-mm .

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