W25M02GW datasheet, memory equivalent, Winbond

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.... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 7 3.1 Pad Configuration WSON 8x6-mm ...... 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Ball Configuration TFBGA 8x6-mm (5x.

Description

......... 6 2. FEATURES..... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 7 3.1 Pad Configuration WSON 8x6-mm ...... 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ......... 8 3.4 Ball Description TF.

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