25Q64JVFJQ datasheet, memory equivalent, Winbond

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3. PACKAGE TYPES AND PIN CONFIGURATIONS .........5 3.1 Pin Configuration SOIC 208-mil ......5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm 5 3.3 Pin Descriptio.

Description

....4 2. FEATURES4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .........5 3.1 Pin Configuration SOIC 208-mil ......5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm.5 3.4 Pin Con.

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